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Less shadowing and lower resistance loss
High-density encapsulation technology optimizes power output with a good balance between and module efficiency improvement of 0.2~0.3%
Minimum Energy Losses with Half Cut (HC) Technology
It offers minimal risk of micro cracks thanks to its cell strength, which aims to maximize product reliability.
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Electrical Characteristics at STS |
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Panel Type |
Half-Cut Monocrystalline |
Pmax | 550 W |
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Vmp |
41.40 V |
Imp |
13.40 A |
| Voc | 49.80 V | Isc |
14.00 A |
